System-in-Package allows multiple integrated circuits to be enclosed in a single package. SiP can perform all or most of the electronic functions in a device. These devices include cell phones, and other portable electronic devices which require compact packaging solutions. This technology makes it possible to stack dies containing integrated circuits vertically mounted on top of each other. The previous method was to place the dies next to each other. System-in-Package therefore saves space and allows for ever smaller models to be produced. Get more information here amazon codes.
Passive components like resistors and capacitors are combined with several chips in one package. These chips may include DRAM, flash memory and processor. Everything is mounted on the same substrate. This in turn makes the design less complex and less power is required. SiP delivers highly functional integration for radio frequency and digital applications.
Traditionally portable electronic devices like cell … Read More